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Solder Paste in Electronics Packaging

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Author(s): Jennie S. Hwang

Publication date (Print): 1989

Publisher: Springer Netherlands

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ISBN (Print): 978-94-011-6052-0

ISBN (Electronic): 978-94-011-6050-6

Publication date (Print): 1989

DOI: 10.1007/978-94-011-6050-6

SO-VID: ae7aa1c0-e966-45cb-ad10-814c3dafe29c

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Cited by 11

Lead-free Solders in Microelectronics
Authors: Mulugeta Abtew, Guna Selvaduray
Characterization of eutectic Sn-Bi solder joints
Authors: Z Mei, J W Morris
Metallurgy of low temperature Pb-free solders for electronic assembly
Authors: J Glazer

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