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Solder Joint Reliability : Theory and Applications
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Editor(s):
John H. Lau
Publication date
(Print):
1991
Publisher:
Springer US
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Cardiovascular Innovations and Applications
Author and book information
Book
ISBN (Print):
978-1-4613-6743-7
ISBN (Electronic):
978-1-4615-3910-0
Publication date (Print):
1991
DOI:
10.1007/978-1-4615-3910-0
SO-VID:
6d40a633-41c8-45da-936c-0534acbb5cfc
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Book chapters
pp. 1
Flux Reactions and Solderability
pp. 38
Solder Paste Technology and Applications
pp. 92
Technical Considerations in Vapor Phase and Infrared Solder Reflow Processes
pp. 117
Optimizing the Wave Soldering Process
pp. 143
Post-Solder Cleaning Considerations
pp. 173
Scanning Electron Microscopy and Energy Dispersive X-ray (SEM/EDX) Characterization of Solder Solderability and Reliability
pp. 225
The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder Joints
pp. 266
Microstructure and Mechanical Properties of Solder Alloys
pp. 279
The Interaction of Creep and Fatigue in Lead-Tin Solders
pp. 306
Creep and Stress Relaxation in Solder Joints
pp. 333
Effects of Strain Range, Ramp Time, Hold Time, and Temperature on Isothermal Fatigue Life of Tin-Lead Solder Alloys
pp. 361
A Damage Integral Methodology for Thermal and Mechanical Fatigue of Solder Joints
pp. 384
Modern Approaches to Fatigue Life Prediction of SMT Solder Joints
pp. 406
Predicting Thermal and Mechanical Fatigue Lives from Isothermal Low Cycle Data
pp. 455
Static and Dynamic Analyses of Surface Mount Component Leads and Solder Joints
pp. 508
Integrated Matrix Creep: Application to Accelerated Testing and Lifetime Prediction
pp. 545
Solder Attachment Reliability, Accelerated Testing, and Result Evaluation
pp. 588
Surface Mount Attachment Reliability and Figures of Merit for Design for Reliability
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