Advanced Materials for Thermal Management of Electronic Packaging

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Author(s): Xingcun Colin Tong

Publication date (Print): 2011

Publisher: Springer New York

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ISBN (Print): 978-1-4419-7758-8

ISBN (Electronic): 978-1-4419-7759-5

Publication date (Print): 2011

DOI: 10.1007/978-1-4419-7759-5

SO-VID: 0c68260f-d86f-4682-b9d2-b4cc3378cb3c

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