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      Effects of functionalization and silane modification of hexagonal boron nitride on thermal/mechanical/morphological properties of silicon rubber nanocomposite

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          Abstract

          Hexagonal boron nitride (h-BN) nanoparticles could induce interesting properties to silicone rubber (SR) but, the weak filler-matrix interfacial interaction causes agglomeration of the nanoparticles and declines the performance of the nanocomposite. In this work, h-BN nanoparticles were surface modified using vinyltrimethoxysilane (VTMS) at different concentrations. Before silane modification, h-BN nanoparticles were hydroxylated using 5 molar sodium hydroxide. The nanoparticles were characterized to assess success of silane grafting. The pure and modified h-BN nanoparticles were applied at 1, 3 and 5 wt% to HTV silicon rubber (SR). The curing, thermal, mechanical and morphological properties and hydrophobicity of the nanocomposites were evaluated. The morphology of the SR nanocomposites was characterized using AFM and FE-SEM analysis. It was found that silane grafting on the h-BN nanoparticles improves crosslink density but declines curing rate index (CRI) of the SR nanocomposite (at 5 wt% loading content) by 0.7 (dN m) and 3.5%, respectively. It also increased water contact angle of the nanocomposites from 97.5° to 107°. The improved nanoparticle-rubber interfacial interactions caused better dispersion of h-BN nanoparticles in SR matrix (at 5 wt%) that enhanced the elongation at break, modulus at 300% and Tg of the SR nanocomposites.

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          Preparation and characterization of surface modified boron nitride epoxy composites with enhanced thermal conductivity

          The fabricated surface modified boron nitride epoxy composites exhibit high thermal conductivity, superior thermal stability and good mechanical properties while retaining good electrical insulation properties. Hexagonal boron nitride (h-BN) microparticles, modified by surface coupling agent 3-aminopropyl triethoxy silane (APTES), were used to fabricate thermally conductive epoxy/BN composites, and the effects of modified-BN content on the thermal and insulating properties were investigated. It was found that incorporation of h-BN particles in the epoxy matrix significantly enhanced the thermal conductivity of the composites. With 30 wt% modified-BN loading, the thermal conductivity of the composites was 1.178 W m −1 K −1 , 6.14 times higher than that of the neat epoxy. Fabricated epoxy/BN composites exhibited improved thermal stability, storage modulus, and glass transition temperature with increased BN content. The composites also possessed excellent electrical insulation properties. These results revealed that epoxy/BN composites are promising as efficient heat-releasing materials for thermal management and microelectronic encapsulation.
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            Properties of thermally conductive micro and nano size boron nitride reinforced silicon rubber composites

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              Improvement in thermal conductivity of through-plane aligned boron nitride/silicone rubber composites

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                Author and article information

                Contributors
                mjamshidi@iust.ac.ir
                Journal
                Sci Rep
                Sci Rep
                Scientific Reports
                Nature Publishing Group UK (London )
                2045-2322
                24 July 2023
                24 July 2023
                2023
                : 13
                : 11915
                Affiliations
                [1 ]GRID grid.411748.f, ISNI 0000 0001 0387 0587, Constructional Polymers and Composites Research Lab., School of Chemical, Petroleum and Gas Engineering, , Iran University of Science and Technology (IUST), ; Tehran, Iran
                [2 ]GRID grid.46072.37, ISNI 0000 0004 0612 7950, School of Chemistry, College of Science, , University of Tehran, ; Tehran, Iran
                Article
                39203
                10.1038/s41598-023-39203-5
                10366181
                37488247
                f8209ecb-cd29-4a1d-ac67-7b8f7d6a879e
                © The Author(s) 2023

                Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.

                History
                : 24 April 2023
                : 21 July 2023
                Categories
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                © Springer Nature Limited 2023

                Uncategorized
                chemical engineering,materials for energy and catalysis,nanoscale materials,soft materials,other nanotechnology

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